Expertise

For over fifty years, our foundational work across signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) has been dedicated to bringing absolute clarity out of electromagnetic chaos. In 1996, during the foundational days of the gigabit era, we actively advocated to the leadership of Ansoft for a critical industry pivot: moving away from narrow, single-frequency models toward broadband, multi-frequency matrix simulations. History proved that worldview correct. Today, as an IEEE Life Senior Member and a long-standing contributor to foundational industry standards committees – including serving as the original editor for the T10 Committee’s SCSI Signal Modeling (SSM) project and contributing to the EIA IBIS Open Forum – we bring that exact same forward-thinking, first-principles discipline to modern, high-density hardware infrastructure.

Core Analytical Disciplines

  • Advanced Signal Integrity (SI): We treat high-speed PCB traces not as simple digital paths, but as complex, lossy transmission lines subject to high-frequency wave mechanics. Our expertise centers on wideband multi-frequency matrix/ultra-high-speed bus/module channel analysis. We mathematically isolate and mitigate skin effect losses, dielectric dispersion, and high-speed reflections. Through precision IBIS and S-parameter modeling, measurements, and observations, we optimize complex interconnect topologies to preserve signal transitions before fabrication.
  • High-Voltage & Deterministic Power Integrity (PI): A stable, low-impedance Power Delivery Network (PDN) is mandatory for high-speed system survival. We specialize in comprehensive PDN optimization and low-impedance layout strategies to eliminate transient noise and voltage droop. Our background spans from low-voltage digital architectures through extreme electrical environments, maintaining proven design mastery over power switching supplies spanning 5V to 35kV. By analyzing the entire interconnected digital network, we ensure power traces do not electromagnetically couple into sensitive digital traces, mitigating the cross-domain transients that standard workflows routinely miss. We ensure dynamic current demands are met without compromising thermal boundaries.
  • Integrated EMC & EMSEC Isolation: Electromagnetic phenomena do not stop at the edge of a board layout, nor can they be decoupled from thermodynamic realities. We specialize in comprehensive emissions reduction, crosstalk mitigation, and the critical intersection where thermal signatures impact EMSEC perimeters. Beyond standard commercial compliance, our background extends from strategic theater-level microwave link engineering to early MECL-based mainframe systems and rigorous emission security (EMSEC). Our expertise is in absolute field containment. We use the same deterministic-engineered shielding, material analysis, and isolation techniques to suppress both thermal and unintended RF compromising emanations, ensuring strict data containment within secure operational perimeters.
  • Advanced Packaging & Multichip Modules (MCM): As silicon dimensions shrink, board-level routing cannot be decoupled from component packaging physics. We apply advanced MCM co-design methodologies engineered to systematically isolate sensitive, high-frequency components from surrounding circuit heat and parasitic noise. By managing mutual inductances, thermal dissipation paths, and structural substrate parasitics, we protect system fidelity at the microscopic integration level.

Industry Endorsement

“Larry is an excellent signal integrity engineer. His knowledge of PCB materials, stack-up, layout and fabrication is exceptional. Larry is fluent in signal integrity from both a practical and theory standpoint.”
— Dean Wallace, Retired VP of Engineering, Marvell Semiconductor