Expertise

Since 1971, my career has centered on deterministic physics across signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC). Beginning as a US Army Signal Corps engineer designing strategic theater communications, my work evolved to hardware architecture, packaging patents, and industry standards leadership—including serving as Vice Chair and Editor for the ANSI/INCITS T10 SCSI Signal Modeling project. In 1996, I worked directly with Ansoft leadership to advocate for broadband, multi-frequency matrix solvers to capture high-speed dispersion and skin-effect losses. As an IEEE Life Senior Member, I apply this long-range, first-principles discipline to complex, high-density hardware infrastructure.

Advanced Signal Integrity (SI)

High-speed interconnect traces, substrate routes, and packaging channels are not simple digital paths, but complex transmission lines subject to high-frequency wave mechanics.

• Matrix & Channel Analysis: Wideband, multi-frequency analysis to mathematically isolate and mitigate skin-effect losses, dielectric dispersion, and high-speed reflections.
• Interconnect Optimization: Precision IBIS and S-parameter modeling to resolve signal transitions and impedance discontinuities prior to fabrication.

High-Voltage & Deterministic Power Integrity (PI)

Stable, low-impedance Power Delivery Networks (PDNs) are essential to prevent transient noise and voltage droop in high-speed systems.

• 5V to 35kV Spectrum: Practical design experience spanning low-voltage digital architectures up to high-voltage 35kV switching power supplies.
• Cross-Domain Coupling Mitigation: System-level analysis of power distribution networks to prevent power traces from coupling into sensitive signal paths—resolving transients overlooked by standard workflows.
• Thermal & Transient Optimization: Layout strategies engineered to satisfy dynamic current demands within strict thermal boundaries.

Integrated EMC & EMSEC Isolation

Electromagnetic phenomena extend beyond board edges and interact directly with system physical parameters.

• Full-Spectrum Field Containment: Specialized techniques for emissions reduction, crosstalk mitigation, and field containment across commercial and defense environments.
• Strategic & Security Background: Direct experience ranging from theater-level microwave link engineering to emission security (EMSEC) compliance.
• Thermal & RF Suppression: Co-designed shielding, material selection, and physical isolation to suppress thermal signatures and unintended RF emanations.

Advanced Packaging & Heterogeneous Integration

As silicon geometry scales, substrate routing remains fundamentally tied to component packaging physics.

• Packaging Co-Design: Heterogeneous packaging and MCM strategies engineered to isolate sensitive microelectronics from localized noise and heat.
• Parasitic & Thermal Control: Management of mutual inductances, thermal dissipation paths, and substrate parasitics at the microscopic integration level.

Industry Endorsement

“Larry is an excellent signal integrity engineer. His knowledge of PCB materials, stack-up, layout and fabrication is exceptional. Larry is fluent in signal integrity from both a practical and theory standpoint.”
— Dean Wallace, Retired VP of Engineering, Marvell Semiconductor